epoxy cures to a slightly
flexible consistency. This lack of brittleness allows it to form a lasting bond
in areas subjected to high vibration or stress. QUIK-CURE™ shouldn’t be used in
areas that are subject to long-term immersion in water; however, it works fine
for the internal structure of wood framed boats. QUIKCURE™ is our only epoxy on
which you can apply polyester resins. It can be mixed with microballoons to form
a quick setting putty. Items bonded with QUIK-CURE™ can be handled after 15
minutes. Full strength is reached in 1 hour.
MID-CURE™ 15 min. epoxy is used in larger areas where more working time is needed.
It is more water resistant and can be used as a substitute for QUIK-CURE™ in
most applications. MID-CURE™ is our most flexible epoxy and is ideal for gluing
to fiberglass surfaces. Allow 45 minutes before handling parts and 2 hours for
SLOW-CURE™ 30 min. epoxy works best for
forming reinforcing fillets on joints. It has the highest strength of our
epoxies. It is waterproof and more heat resistant. SLOW-CURE™ can be used for
bonding if you’re willing to wait overnight. Fillers such as microballoons can
be mixed with SLOW-CURE™ and FINISH-CURE™ to form a putty-like consistency. Such
fillers will usually decrease the working time by about 25%. Bonded objects can
be handled after 8 hours and the cured epoxy reaches full strength within 24
medium thickness, medium strength threadlock that is applied to the threads of
fasteners before assembly. Once the IC-Loc Blue™ is cured, the fasteners can be
disassembled with standard hand tools if required.
#301 Extender Tip
For use over
BSI's standard #312 top. Can be used with all thicknesses of CA except IC-Gel.
The flexible tip can be cut to the length and/or inside diameter that is needed
for a particular application.
#303 Extra Long Extender Tip
For use over the standard #312 top, they provide a rigid tip
with extended length to get thin and gap filling CA into hard to reach areas.
They are very resistant to clogging and can be cleaned by soaking in acetone.